Issue:
1
Volume 4, Number 1, 2019
High Efficiency Low Profile Heat Sink for Air Cooling of Microelectronics
Lian-Tuu Yeh*
Abstract | References | PDF | HTML | Pub. Date: Aug 8, 2019
DOI: 10.23977/jeis.2019.41013 | Downloads: 15 | Views: 226
Novel Thermal Solution for Low Profile 1U Horizontal Box with Passive Cooling
Lian-Tuu Yeh*
Abstract | References | PDF | HTML | Pub. Date: Apr 10, 2019
DOI: 10.23977/jeis.2019.41012 | Downloads: 13 | Views: 434
Water Conservancy Data Acquisition and Big Data Service Based on Multi-data Sources
Xu Zhu*
Abstract | References | PDF | HTML | Pub. Date: Jan 25, 2019
DOI: 10.23977/jeis.2019.41001 | Downloads: 20 | Views: 445
