Author(s)

Zhu Xiangcai ¹, Wang Xia ¹, Xu Jian ¹, Li Dan ¹

Affiliation(s)

¹ School of Information Science and Technology, Taishan University, Tai'an, 271021, China

Corresponding Author

Zhu Xiangcai

ABSTRACT

This paper expounds the research background and main research contents of integration platform about credit risk evaluation, including SOA echnology, SOA application module and FTA method, and puts forward reasonable technical research route and solutions to key problems. The credit grade is divided into five grades, which means the credit grade is from high to low, and the loan risk is from low to high, and the credit index is divided into three grades and nine categories. The indexes are trained with related algorithms, and different weights are obtained to determine the importance of the indexes. According to various indicators, draw the corresponding decision tree to study and predict credit risk. This paper discusses the related functions of SOA module and related evaluation technology of FTA module, analyzes the social and economic benefits of platform application, and expounds the related contents of achievement transformation and popularization and application, which provides theoretical support and new direction of technology application for urban managers.

KEYWORDS

SOA Technology, FTA Method, Credit Risk Evaluation

CITE THIS PAPER

Zhu Xiangcai, Wang Xia, Xu Jian, Li Dan, Research on Integration Platform about Credit Risk Evaluation Based on SOA and FTA. Information Systems and Economics (2023) Vol. 4: 6-12. DOI: http://dx.doi.org/10.23977/infse.2023.041002.

REFERENCES

[1] CHAI Yanmei. Causes and Countermeasures of Credit Risk in Rural Commercial Banks [J]. Chinese & Foreign Entrepreneurs, 2016, (3):35-36. 
[2] YANG Taihua, ZHENG Qinghua. Project Safety Risk Analysis Based on Fault Tree Method [J]. Journal of Systems ＆ Management, 2009, 18(5):511-515. 
[3] SHI Jiyan, YANG Zongliang, LIU Yan, LIU Dongying. The Design and Implementation of the SOA-based Power Grid Service Center System [J]. Electronic Design Engineering, 2017, 25(2):71-75.

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