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Review of Liquid Cooled Microelectronic Equipment

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DOI: 10.23977/jeis.2021.61001 | Downloads: 1 | Views: 24

Author(s)

Lian – Tuu Yeh 1

Affiliation(s)

1 Ph D & PE, ASME Fellow, Thermal Consultant, Dallas, TX, [email protected]

Corresponding Author

Lian – Tuu Yeh

ABSTRACT

The equipment power consumption is continuously increased at a fast pace. For the high power air cooled systems, large high performance fans are becoming a must for the high power systems in order to provide the necessary air flow rates. Two major concerns about these large fans are the power consumption and the acoustic noise of the fans. 
The increased system power results in a significant increase in the power consumption and the operation cost of the equipment as well as its host facilities such as the date centers. For some cases, the system power is too high to be considered by air cooling. The only solution to the above situations is adopting the liquid cooling. The liquid cooling still has many advantages over the air cooled systems including not only able to support higher system power but also  to reduce component temperature along with increased system reliability.
The purpose of this paper is to review how to employ the existing liquid cooling technologies to cooling of electronic equipment in various industries.

KEYWORDS

Liquid Cooled Microelectronic Equipment, Review

CITE THIS PAPER

Lian – Tuu Yeh, Review of Liquid Cooled Microelectronic Equipment. Journal of Electronics and Information Science (2021) 6: 1-16. DOI: http://dx.doi.org/10.23977/jeis.2021.61001

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