Author(s)

Yue Fan, Jinxuan Wang

Corresponding Author

Jinxuan Wang

ABSTRACT

New energy is a very popular topic due to Global climate issues. Most countries propose to be carbon neutral and have their own plane. Solar energy as representative energy has attracted attention. Improving solar energy efficiency is an important research direction. The goal of this article is to determine that production process optimization efficiency. we will collect relevant data, compare and analyze, those processing methods. Since we need pure Silicon to make solar cells, our research will be from making silicon chips. Produce the silicon cells usually reduction and purification steps are needed to get pure silicon recovered from the impure Silicon Dioxide in quartz. This is often done by CAW and FTZ processes, and then put into polycrystalline silicon melt of the Czochralski growth apparatus. And cast it out from melt and pure cylindrical silicon is therefore produced. Cut off both ends of the ingot with a diamond saw, and then cut it into slices. Wafers are sliced from the crystal with diamond coated inside diameter (ID). This step determines the size of the wafer. Then mark ‘flat area’ or ‘indent’ on the slice to clarify the directions and make the following steps more convenient. Here we get the raw wafer, which has an uneven surface. To print circuit patterns on it, we go through grinding, chemical etching and polishing processes to remove surface defects, and form a smooth surface. Then we need to clean up the backside of the wafer. Normally, only the front side goes through the extensive CMP, so the backs may be rough. Backside will be recovered by sandblasting or deposition of the polysilicon layer on. After checking we have the meet the standard wafer. Due to the improvement of production technology, this article will focus on observing the improvement of solar panels by cleaning and doping steps.

KEYWORDS

Solar Cells, Wafer Fabrication Procedures, Solar Energy, Semi-conductor, Integration Circuits, ULSI, SSI