A Research on Transient Thermal Resistance Test Method of IPM Module
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DOI: 10.23977/amce.2019.034
Author(s)
Hui Wei, Dafang Wang
Corresponding Author
Hui Wei
ABSTRACT
IPM modules are currently widely used in household appliances and industrial production. However, since the thermal problem caused by power loss affects the performance of the device, it is crucial to obtain the thermal resistance of the IPM module. In this paper, a thermal resistance definition method based on transient process is proposed to test the thermal resistance of IPM module. The saturation voltage drop of IGBT chip is selected as the temperature sensitivity parameter to calculate the junction temperature. Using the relationship between the saturation voltage drop and the junction temperature under a small current, the saturation voltage drop of the IGBT chip in the IPM is collected in real time, and the junction temperature curve and the transient thermal resistance are obtained.
KEYWORDS
IPM Module, thermal resistance, the saturation voltage drop