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Design of one-dimensional heat conduction model for thin-walled fin in submarine data center

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DOI: 10.23977/ssge.2021.030103 | Downloads: 24 | Views: 1734

Author(s)

Xiang Sun 1, Qi Wang 1, Yue Yang 1, Xiangzhong Meng 1, Junteng Qi 1

Affiliation(s)

1 Resources College, Shandong University of Science and Technology, Tai'an, Shandong 271000

Corresponding Author

Xiang Sun

ABSTRACT

In recent years, due to the rapid growth of big data center in coastal cities, and the high cost of land construction, occupying more land, cooling consumes a lot of power and cold water resources, causing a prominent resource contradiction, thus the undersea data center project came into being. "Undersea data center project" does not occupy or rarely occupies land resources, saves energy consumption, does not need fresh water consumption, and can greatly shorten the distance between data and users, and has the characteristics of low cost, low delay, high reliability and high security, so as to realize the green and sustainable development of big data center. However, the project is a new project, there are still many areas to be improved. How to design the container shell structure for heat dissipation is a very worthy of discussion. Firstly, we determine the geometry of the container by comparing the surface area of the cuboid and the cylinder under the same volume; Then, in order to ensure more sufficient heat dissipation conditions, we consider increasing the surface area of heat dissipation by adding fins. A one-dimensional heat conduction model of thin-walled fin is established. Under different thermal conductivity conditions, rectangular fin, triangular fin or parabolic fin are arranged. Finally, we designed the overall shape of the container and select the material of the shell to ensure the best heat dissipation effect.

KEYWORDS

Thin wall fin, One dimensional heat conduction model, Undersea data center

CITE THIS PAPER

Xiang Sun, Qi Wang, Yue Yang, Xiangzhong Meng, Junteng Qi. Design of one-dimensional heat conduction model for thin-walled fin in submarine data center. Smart Systems and Green Energy (2021) Vol. 3: 15-20. DOI: http://dx.doi.org/10.23977/ssge.2021.030103

REFERENCES

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[2] Cao Zhenbo, Li Yilong, Zhu Yuanbin, Zhong Yi, analysis and comparison of heat dissipation capacity of three kinds of flat fins, chemical engineering [J], 2013, (10)
[3] Tang Zhonghui, design of new heat dissipation structure for electronic products [J]. Digital design (2), 2019, (8), 215

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