Analysis of electric field defect problems based on IGBT modules
DOI: 10.23977/jeeem.2024.070307 | Downloads: 3 | Views: 185
Author(s)
Zikang He 1, Fei Wu 2
Affiliation(s)
1 School of Electrical Engineering, Tongda College of Nanjing University of Posts and Telecommunications, Yangzhou, 225100, China
2 School of Electrical Engineering, Xinjiang University, Urumqi, 830049, China
Corresponding Author
Fei WuABSTRACT
With the development of new power systems, IGBT has been more widely used in rail transit, new energy vehicles, photovoltaic power generation and other fields. The high efficiency and reliability of electrical insulation have received widespread attention. In this paper, in order to solve the problem of defects in the use of IGBT chips in the electrostatic field, the IGBT electrostatic field simulation model was constructed in COMSOL through the finite element method, and the results of different defects were explored through the electric field distributions presented in the simulation results. It is concluded that voids, bubbles, and metal protrusion defects all have an effect on the electric field distribution at the triple bonding point, and the field strength inside the defects is greater. Meanwhile, the corresponding data base is also provided for the device design of IGBT.
KEYWORDS
Insulated gate bipolar transistor (IGBT), electrostatic field simulation, triple junction, defect problemCITE THIS PAPER
Zikang He, Fei Wu, Analysis of electric field defect problems based on IGBT modules. Journal of Electrotechnology, Electrical Engineering and Management (2024) Vol. 7: 53-63. DOI: http://dx.doi.org/10.23977/jeeem.2024.070307.
REFERENCES
[1] Dai Chao, Chen Xiangrong. A review of research on packaging and insulation of silicon carbide IGBT power electronics [J]. Zhejiang Electric Power, 2019, 38(10):26-33.DOI:10.19585/j.zjdl.201910005.
[2] Wang Zhengdong, Luo Meng, Cheng Yonghong. A review on the failure mechanism of high-voltage high-power IGBTs and the research on high-temperature-resistant modified organosilicon potting materials[J]. High Voltage Technology, 2023, 49(04):1632-1644.DOI:10.13336/j.1003-6520.hve.20221925.
[3] Wen Teng. Calculation method and application research of transient electric field inside crimped IGBT devices[D]. North China Electric Power University (Beijing), 2022. DOI:10.27140/d.cnki.ghbbu.2022.000142.
[4] Yuan W.B. Research on key technology of condition monitoring and fault diagnosis of IGBT module [D]. Hefei University of Technology, 2022. DOI:10.27101/d.cnki.ghfgu.2022.001510.
[5] Sun Junda. Analysis of internal electric field and insulation design of crimped IGBT devices[D]. North China Electric Power University (Beijing), 2017.
[6] Liu Zhaocheng, Cui Xiang, Li Xuebao, et al. A review of research on electric field calculation of insulation structure of high-voltage high-power IGBT devices[J]. Chinese Journal of Electrical Engineering, 2024, 44(01):214-231.DOI:10. 13334/j. 0258-8013.pcsee.223284.
[7] Li Wenyi, Wang Yalin, Yin Yi. A review of reliability studies on package insulation for high-voltage power modules[J]. Chinese Journal of Electrical Engineering, 2022, 42(14):5312-5326.DOI:10.13334/j.0258-8013.pcsee.210545.
[8] Zhou Z , Sha Y , Wei L ,et al.Thermal Stress Analysis of IGBT Module Based on ANSYS[J].Springer, Cham, 2022.DOI:10.1007/978-3-030-81007-8_30.
[9] Yin Zhihao, Yu Dianru, Zhu Jiafeng, et al. A review of IGBT power module package failure mechanisms and monitoring methods[J]. New Technology of Electrical Engineering, 2022, 41(08):51-70.
[10] Liu Renkuan, Li Hui, Yu Kai, et al. Analysis of package state monitoring method for soldered IGBT devices[J]. Electrotechnology, 2022, (15):71-78+82.DOI:10.19768/j.cnki.dgjs.2022.15.019.
[11] Zhou W.D. Electric-thermal-force coupling and failure analysis of IGBT modules [D]. South China University of Technology, 2016.
[12] Liu SJ, Wen Teng, Li XB, et al. Electric field transient characteristics in the package insulation structure of high-voltage high-power elastically crimped IGBT devices[J]. Journal of Electrotechnology, 2023, 38(23):6253-6265.DOI: 10.19595/j. cnki.1000-6753.tces.221474.
[13] Yue Yajing. Failure analysis and research on bonding wire of IGBT power module[D]. Tianjin University of Technology, 2019.
[14] Waheed A , Rehman S U , Alsaif F ,et al.Hybrid multimodule DC–DC converters accelerated by wide bandgap devices for electric vehicle systems[J].Scientific Reports, 2024, 14(1).DOI:10.1038/s41598-024-55426-6.
[15] He B. Failure mechanism analysis of IGBT based on Comsol multiphysics field coupling simulation[D]. Harbin Institute of Technology, 2021. DOI:10.27063/d.cnki.ghlgu.2021.000367.
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