Education, Science, Technology, Innovation and Life
Open Access
Sign In

Research on Electrochemical Migration Failure Behavior of Automobile Circuit Board

Download as PDF

DOI: 10.23977/jeeem.2024.070305 | Downloads: 11 | Views: 211

Author(s)

Xin Wang 1, Kaixu Ren 1, Mengmeng Zhuang 1, Peng Liu 1, Xiuxu Wang 1, Jiawei Zhao 1, Jiayu Wang 1

Affiliation(s)

1 Automotive Data of China Co., Ltd., Beijing, China

Corresponding Author

Xin Wang

ABSTRACT

In this paper, the electrochemical migration experiments of circuit boards with different electrodes size and spacing were investigated under different voltage bias by water drop method experiments. Furthermore, based on standard size spacing specimens, experiments of specific voltage bias were conducted under the influence of different chloride ion concentration and adipic acid concentration. Thus, the electrochemical migration failure behavior of automobile circuit boards is deeply explored, providing a basis for improving the reliability of automotive electronic products.It is concluded that bias voltage is the driving force for electrochemical migration, and smaller spacing and larger electrode size increase the probability of metal ions in the dielectric reaching the cathode surface. The increase in chloride ion concentration leads to an increase in the inter electrode current, followed by a large amount of precipitation between the electrodes, resulting in an increase in the resistivity of the entire solution. Therefore, the inter electrode current decreases to a stable value, further increasing the probability of electrochemical migration. However, low concentrations of chloride ions do not participate in the formation of precipitation and dendrite growth. When the concentration of chloride ions is high, chloride ions further promote electrochemical migration by dissolving tin hydroxides. The impact mechanisms of adipic acid and sodium chloride on electrochemical migration are different. The acid ions generated by the ionization of adipic acid will react with tin ions in the solution, hindering the diffusion of tin ions and thus delaying the initiation and growth of dendrites.

KEYWORDS

Automobile circuit board, Electrochemical migration, Electrode factors, Environmental pollutants, Failurey

CITE THIS PAPER

Xin Wang, Kaixu Ren, Mengmeng Zhuang, Peng Liu, Xiuxu Wang, Jiawei Zhao, Jiayu Wang, Research on Electrochemical Migration Failure Behavior of Automobile Circuit Board. Journal of Electrotechnology, Electrical Engineering and Management (2024) Vol. 7: 37-46. DOI: http://dx.doi.org/10.23977/jeeem.2024.070305.

REFERENCES

[1] Minzari D, Jellesen M S, Per Mφller, et al. On the electrochemical migration mechanism of tin in electronics[J]. Corrosion Science, 2011, 53(10):3366-3379.
[2] He X, Azarian M H, Pecht M G. Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder [J]. Journal of Electronic Materials, 2011, 40(9):1921-1936.
[3] Verdingovas V, Jellesen M S, Ambat R. Colorimetric Visualization of Tin Corrosion: A Method for Early Stage Corrosion Detection on Printed Circuit Boards [J]. Microelectron Reliab, 2017, 73: 158-166.
[4] Xiankang Zhong, Longjun Chen, BálintMedgyes, et al. Electrochemical Migration of Sn and Sn Solder Alloys: a Review [J]. Rsc Advances, 2017, 7(45):28186-28206.
[5] He X, Azarian M H, Pecht M G. Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder[J]. Journal of Electronic Materials, 2011, 40(9):1921-1936.
[6] Lee E L, Haseeb A S M A, Basirun W J, et al. In-Situ Study of Electrochemical Migration of Tin in The Presence of Bromide Ion [J]. Sci Rep, 2021, 11(1): 15.
[7] Zhou Y, Li Y, Chen Y, et al. Life Model of the Electrochemical Migration Failure of Printed Circuit Boards Under NaCl Solution[J]. IEEE Transactions on Device and Materials Reliability, 2019, PP(99):1-10.
[8] Zhu M. Modeling of Electrochemical Migration Caused by Interaction of Dustparticles and Temperature & Humidity Environment [D]. Beijing University of Posts and Telecommunications, 2017.
[9] Liao B, Chen Z, Qiu Q, et al. Inhibitory effect of cetyltrimethylammonium bromide on the electrochemical migration of tin in thin electrolyte layers containing chloride ions [J]. Corrosion science, 2017, 118(APR.):190-201.
[10] Liao B. Study on The Corrosion, Electrochemical Migration and ItsInhibition Mechanism of Tin Based Lead-free Solder Alloysunder Thin Electrolyte Layers [D]; Huazhong University of Science and Technology, 2018.
[11] Yi P. Study on Electrochemical Migration Behavior of SnAgCu Solder Alloy under Thin Electrolyte Film and Controlling of Corrosion Resistance [D]; University of Science and Technology Beijing, 2021.
[12] Zhong X. The Corrosion and Electrochemical Migration of Tin under Thin Electrolyte Layers [D]; Huazhong University of Science and Technology, 2014
[13] Qi X, Ma H R, Wang C, et al. Electrochemical Migration Behavior of Sn-based Lead-free Solder [J]. J Mater Sci-Mater Electron, 2019, 30(15): 695-702.

Downloads: 3917
Visits: 161406

Sponsors, Associates, and Links


All published work is licensed under a Creative Commons Attribution 4.0 International License.

Copyright © 2016 - 2031 Clausius Scientific Press Inc. All Rights Reserved.